Jim Rittman Supporting Michigan, Northern Indiana, and Western Ohio
Products & Services
Browse the list of partners and the products and services that Jim represents below. Click on a logo to visit that principal's website for more information, or click a button below to download a digital line card.
Flying Probe, In Circuit Test, Test Program Services
Wafer Dicing, Wafer Mounter, Wafer Cleaner, Water Recycling
Laser Markers, SMT Printers, PCB Handling, PCB Routers, Palletizing
Stencil Cleaners, PCB Batch, Cleaners, PCB In Line Cleaners
Wire Processors, Cable Strippers, Wire Strippers, Tube Cutters, Heat Shrink Cutters
Radial Thru Hole Lead Prep, Axial Thru Hole Lead Prep, DIP Lead Formers & Cutters
Smart SMT Storage, MSD Storage, Stencil Storage, Storage Software
Solder Paste Inspection, Automatic Optical Inspection, Automatic Pin Inspection (OH only)
Lead/Leadfree, Solder Paste, Flux core Wire, SMT Adhesive, Liquid Flux, Tacky Flux
Tape & Reel Services, Flash Programing, Lead Tinning, Axial & Radial Taping
Bar Solder, Wire Solder, Leaded, Lead-Free
Surface Mount Adhesive Dispenser, Conformal Coating Dispenser
Software For: Traceability, Work Instructions, Scheduling, Quality Management
PCB Reverse Engineering, Stencil Inspection, Automated Inspection & Measurement
SMT Reel Splicing Materials, Splicing Tools, ESD Equipment
Ultra Sonic Welding, Heat Staking, Ultra Sonic Wire Splicing
Vacuum Reflow System, High Vacuum Furnaces
Stencils, Advanced Nanocoat, Wave Fixtures, Process Carriers
FHD Video Inspection, Measurement Software, Image Comparison Software
Complete Line Solutions, SMT Printers, SM Dispensers, Pick and Place, AOI Inspection
PCB Chemistry, Pallet Clean, Stencil Clean, Defluxing, Maintenance Cleaning, and Testing Lab (OH only)
Adhesives, Underfills, Conductive Adhesives, Thermal Adhesives
Planetary Mixers, Syringe Chargers, Nano Premix & Pulverize (OH only)
Humidification, Industrial Cooling, Outdoor & Indoor Cooling
Technical Workstations, Storage Solutions, Lab & R&D Workstations
Surface Mount Rework, Through Hole Rework, Die Placement
Bond Test, Wafer Bond Testing, Micro Material Testing, Automated Bond Testing
Robots Cobots, Work Cell Automation, Integration
Dicing Surfactants, Injector Systems, Cleaning Solutions
Advanced residue free composite film adhesives engineered to bond wafers, thin film heads, optics and other substrates during dicing, grinding, lapping and polishing.
Contact Jim
Interested in learning more about the products and services Jim represents? Submit your details using the form below or call (440) 725-2957. We look forward to serving you!