Call or text Jim Rittman at (440) 725-2957

Jim Rittman Supporting Michigan, Northern Indiana, and Western Ohio

Products & Services

Browse the list of partners and the products and services that Jim represents below. Click on a logo to visit that principal's website for more information, or click a button below to download a digital line card.

Flying Probe, In Circuit Test, Test Program Services

Wafer Dicing, Wafer Mounter, Wafer Cleaner, Water Recycling

Laser Markers, SMT Printers, PCB Handling, PCB Routers, Palletizing

Stencil Cleaners, PCB Batch, Cleaners, PCB In Line Cleaners

Wire Processors, Cable Strippers, Wire Strippers, Tube Cutters, Heat Shrink Cutters

Radial Thru Hole Lead Prep, Axial Thru Hole Lead Prep, DIP Lead Formers & Cutters

Smart SMT Storage, MSD Storage, Stencil Storage, Storage Software

Solder Paste Inspection, Automatic Optical Inspection, Automatic Pin Inspection (OH only)

Lead/Leadfree, Solder Paste, Flux core Wire, SMT Adhesive, Liquid Flux, Tacky Flux

Tape & Reel Services, Flash Programing, Lead Tinning, Axial & Radial Taping

Bar Solder, Wire Solder, Leaded, Lead-Free

Surface Mount Adhesive Dispenser, Conformal Coating Dispenser

Software For: Traceability, Work Instructions, Scheduling, Quality Management

PCB Reverse Engineering, Stencil Inspection, Automated Inspection & Measurement

Ultra Sonic Welding, Heat Staking, Ultra Sonic Wire Splicing

Vacuum Reflow System, High Vacuum Furnaces

Stencils, Advanced Nanocoat, Wave Fixtures, Process Carriers

FHD Video Inspection, Measurement Software, Image Comparison Software

Complete Line Solutions, SMT Printers, SM Dispensers, Pick and Place, AOI Inspection

PCB Chemistry, Pallet Clean, Stencil Clean, Defluxing, Maintenance Cleaning, and Testing Lab (OH only)

Adhesives, Underfills, Conductive Adhesives, Thermal Adhesives

Planetary Mixers, Syringe Chargers, Nano Premix & Pulverize (OH only)

Humidification, Industrial Cooling, Outdoor & Indoor Cooling

Technical Workstations, Storage Solutions, Lab & R&D Workstations

Surface Mount Rework, Through Hole Rework, Die Placement

Bond Test, Wafer Bond Testing, Micro Material Testing, Automated Bond Testing

Robots Cobots, Work Cell Automation, Integration

Dicing Surfactants, Injector Systems, Cleaning Solutions

Advanced residue free composite film adhesives engineered to bond wafers, thin film heads, optics and other substrates during dicing, grinding, lapping and polishing.

Contact Jim

Interested in learning more about the products and services Jim represents? Submit your details using the form below or call (440) 725-2957. We look forward to serving you!